Honor Magic 3 series is all set to launch on August 12 for the Chinese market. The company has been teasing the device for the last few weeks. The Honor Magic 3 series is said to have three phones which are rumored to carry model numbers – ELZ-AN00, ELZ-AN10, and ELZ-AN20. Today, one of the Magic 3 series phones with model number ELZ-AN10 appeared on Geekbench with key specifications.
As per the Geekbench listing, the phone is powered by an SM8350 code-named motherboard. Qualcomm has given the same codename to Snapdragon 888 and 888 Plus chipset. The Plus SoC has an overclocked prime core that reaches a maximum speed of 3GHz which can be seen in the Geekbench result. It confirms that Honor ELZ-AN10 is powered by Snapdragon 888 Plus chipset.
The smartphone boots Android 11 OS. The 8GB RAM variant of the phone was benchmarked on Geekbench v4, which managed to pull off 3556 points in the single-core and 10,257 points in the multi-core department.
A recent teaser shared by the company on Weibo reveals that the Magic 3 series has a pill-shaped cutout for the dual selfie camera. The display is very much curved than a regular curved phone. [see the video] [the_ad id=”11678″]
Reliable Weibo tipster @RODENT950 recently shared the Honor Magic 3 series render, which shows a circular camera module on the rear side housing a total of 5 sensors and LED flash. We’ll get to more about the Magic 3 series once the company put more teasers.[via]