Realme is in the works to bring multiple phones. The brand has already confirmed that its next-generation flagship phone – Realme GT 2 Pro – will arrive on December 20. The company is also expected to bring the vanilla Realme GT 2 on the same date. There’s another phone reportedly in the works, Realme K50. Now, we have started hearing about the Realme GT Neo 3.
The first set of information about the Realme GT Neo 3 is coming from a reliable Chinese tipster, Digital Chat Station. He claims that the device will pack MediaTek Dimensity 8000 chipset. He also reveals that the Redmi K50 series will also feature the same chip. The standard Redmi K50 is rumored to feature a 120Hz display, triple rear cameras, and fast charging support.
MediaTek Dimensity 8000 SoC
Taiwanese chipmaker MediaTek recently unveiled its most powerful chip for mobile phones – the Dimensity 9000. The chip even beat Qualcomm’s powerful Snapdragon 8 Gen 1 in the Geekbench test by putting aggressive single-core and multi-core scores.
While the Dimensity 9000 SoC will power high-end phones, the Dimensity 8000 SoC will be a low-cost chip for mid-range phones. At the Dimensity 9000 announcement event, the company also teased the Dimensity 8000 but didn’t reveal any information. According to a recent leak by Digital Chat Station, the chip is fabricated on TSMC’s 5nm process, an upgrade from the 6nm-based Dimensity 1000 series.
The Dimensity 8000 SoC is tipped to have 4 ×2.75GHz Cortex-A78 cores having the older ARMv8 designs and 4 × 2.0GHz Cortex-A55 cores. The chip is integrated with the Mali-G510 MC6 GPU. The Dimensity 8000 chip is said to support 168Hz displays at 1080p+ resolution, 120 Hz at 1440p+ resolution, up to LPDDR5 RAM, and UFS 3.1 storage.
MediaTek is really giving tough competition to chip giant, Qualcomm. According to recent Counterpoint research for the smartphone SoC shipments for the July-September 2021 period, MediaTek is much ahead of Qualcomm with a 40% market share, whereas Qualcomm holds just a 27% market share.